Daily Papers

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

To coupe with the difficulties in the process of inspection and classification of defects in Printed Circuit Board (PCB), other researchers have proposed many methods. However, few of them published their dataset before, which hindered the introduction and comparison of new methods. In this paper, we published a synthesized PCB dataset containing 1386 images with 6 kinds of defects for the use of detection, classification and registration tasks. Besides, we proposed a reference based method to inspect and trained an end-to-end convolutional neural network to classify the defects. Unlike conventional approaches that require pixel-by-pixel processing, our method firstly locate the defects and then classify them by neural networks, which shows superior performance on our dataset.

Outsourced printed circuit board (PCB) fabrication necessitates increased hardware assurance capabilities. Several assurance techniques based on automated optical inspection (AOI) have been proposed that leverage PCB images acquired using digital cameras. We review state-of-the-art AOI techniques and observe a strong, rapid trend toward machine learning (ML) solutions. These require significant amounts of labeled ground truth data, which is lacking in the publicly available PCB data space. We contribute the FICS PCB Image Collection (FPIC) dataset to address this need. Additionally, we outline new hardware security methodologies enabled by our data set.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

There can be numerous electronic components on a given PCB, making the task of visual inspection to detect defects very time-consuming and prone to error, especially at scale. There has thus been significant interest in automatic PCB component detection, particularly leveraging deep learning. However, deep neural networks typically require high computational resources, possibly limiting their feasibility in real-world use cases in manufacturing, which often involve high-volume and high-throughput detection with constrained edge computing resource availability. As a result of an exploration of efficient deep neural network architectures for this use case, we introduce PCBDet, an attention condenser network design that provides state-of-the-art inference throughput while achieving superior PCB component detection performance compared to other state-of-the-art efficient architecture designs. Experimental results show that PCBDet can achieve up to 2times inference speed-up on an ARM Cortex A72 processor when compared to an EfficientNet-based design while achieving sim2-4\% higher mAP on the FICS-PCB benchmark dataset.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

Printed Circuit Board (PCB) assurance in the optical domain is a crucial field of study. Though there are many existing PCB assurance methods using image processing, computer vision (CV), and machine learning (ML), the PCB field is complex and increasingly evolving so new techniques are required to overcome the emerging problems. Existing ML-based methods outperform traditional CV methods, however they often require more data, have low explainability, and can be difficult to adapt when a new technology arises. To overcome these challenges, CV methods can be used in tandem with ML methods. In particular, human-interpretable CV algorithms such as those that extract color, shape, and texture features increase PCB assurance explainability. This allows for incorporation of prior knowledge, which effectively reduce the number of trainable ML parameters and thus, the amount of data needed to achieve high accuracy when training or retraining an ML model. Hence, this study explores the benefits and limitations of a variety of common computer vision-based features for the task of PCB component detection using semantic data. Results of this study indicate that color features demonstrate promising performance for PCB component detection. The purpose of this paper is to facilitate collaboration between the hardware assurance, computer vision, and machine learning communities.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

Previous works for PCB defect detection based on image difference and image processing techniques have already achieved promising performance. However, they sometimes fall short because of the unaccounted defect patterns or over-sensitivity about some hyper-parameters. In this work, we design a deep model that accurately detects PCB defects from an input pair of a detect-free template and a defective tested image. A novel group pyramid pooling module is proposed to efficiently extract features of a large range of resolutions, which are merged by group to predict PCB defect of corresponding scales. To train the deep model, a dataset is established, namely DeepPCB, which contains 1,500 image pairs with annotations including positions of 6 common types of PCB defects. Experiment results validate the effectiveness and efficiency of the proposed model by achieving 98.6% mAP @ 62 FPS on DeepPCB dataset. This dataset is now available at: https://github.com/tangsanli5201/DeepPCB.

Printed Circuit Board (PCB) schematic design plays an essential role in all areas of electronic industries. Unlike prior works that focus on digital or analog circuits alone, PCB design must handle heterogeneous digital, analog, and power signals while adhering to real-world IC packages and pin constraints. Automated PCB schematic design remains unexplored due to the scarcity of open-source data and the absence of simulation-based verification. We introduce PCBSchemaGen, the first training-free framework for PCB schematic design that comprises LLM agent and Constraint-guided synthesis. Our approach makes three contributions: 1. an LLM-based code generation paradigm with iterative feedback with domain-specific prompts. 2. a verification framework leveraging a real-world IC datasheet derived Knowledge Graph (KG) and Subgraph Isomorphism encoding pin-role semantics and topological constraints. 3. an extensive experiment on 23 PCB schematic tasks spanning digital, analog, and power domains. Results demonstrate that PCBSchemaGen significantly improves design accuracy and computational efficiency.

In this paper, we introduce an approach for detecting modifications in assembled printed circuit boards based on photographs taken without tight control over perspective and illumination conditions. One instance of this problem is the visual inspection of gas pumps PCBs, which can be modified by fraudsters wishing to deceive costumers or evade taxes. Given the uncontrolled environment and the huge number of possible modifications, we address the problem as a case of anomaly detection, proposing an approach that is directed towards the characteristics of that scenario, while being well-suited for other similar applications. The proposed approach employs a deep convolutional autoencoder trained to reconstruct images of an unmodified board, but which remains unable to do the same for images showing modifications. By comparing the input image with its reconstruction, it is possible to segment anomalies and modifications in a pixel-wise manner. Experiments performed on a dataset built to represent real-world situations (and which we will make publicly available) show that our approach outperforms other state-of-the-art approaches for anomaly segmentation in the considered scenario, while producing comparable results on the popular MVTec-AD dataset for a more general object anomaly detection task.

Recent advancements in quality control across various industries have increasingly utilized the integration of video cameras and image processing for effective defect detection. A critical barrier to progress is the scarcity of comprehensive datasets featuring annotated defects, which are essential for developing and refining automated defect detection models. This systematic review, spanning from 2015 to 2023, identifies 15 publicly available datasets and critically examines them to assess their effectiveness and applicability for benchmarking and model development. Our findings reveal a diverse landscape of datasets, such as NEU-CLS, NEU-DET, DAGM, KolektorSDD, PCB Defect Dataset, and the Hollow Cylindrical Defect Detection Dataset, each with unique strengths and limitations in terms of image quality, defect type representation, and real-world applicability. The goal of this systematic review is to consolidate these datasets in a single location, providing researchers who seek such publicly available resources with a comprehensive reference.

Routine inspection of power distribution infrastructure remains challenging for utilities operating geographically dispersed networks, where conventional manual inspection can be difficult to perform consistently and at scale. This work presents a smartphone-based AI inspection system for assessing targeted distribution-infrastructure conditions from images captured by field personnel. The proposed workflow integrates image-quality and viewing-perspective validation with AI-assisted assessment of pole lean, crossarm and top-cleat tilt, voltage level, vegetation-clearance risk, and distribution-transformer (DTR)-ground clearance. The system integrates deep-learning models with monocular depth estimation, geometric analysis, and rule-based processing within a common multi-stage inspection workflow designed for practical field operation. The system was pilot deployed across five selected distribution feeders within the Eastern Power Distribution Company of Andhra Pradesh Ltd. (APEPDCL), where 1,222 defect instances were identified across the assessed categories and subsequently tracked through a rectification and verification workflow, with 84 defect instances recorded as rectified during the study period. Feeder-level interruption records were also examined over the study period; however, the available observations do not provide sufficient evidence to establish a reliability improvement attributable to the proposed system. A curated multi-module field-captured dataset, PD-Defect, is also publicly released to support reproducible research in distribution-infrastructure inspection. The field deployment demonstrates the practical integration of smartphone-based AI-assisted inspection into field inspection and maintenance activities, providing a mechanism for systematic identification, documentation, rectification tracking, and verification of targeted distribution-infrastructure defects.

Printed circuit boards (PCBs) are fundamental to modern electronic systems, yet AI-driven PCB design automation remains constrained by the lack of large-scale paired schematic-netlist datasets. PCB schematics are particularly challenging due to diverse component types, complex wiring topologies, and noisy textual annotations. To address this gap, we present PCBnet, a large-scale PCB schematic dataset comprising over 300 real-world designs with annotated pins and paired SPICE netlists. It contains more than 50,000 component instances, 150,000 wires, 100,000 text regions, and 400,000 characters. We further develop an automated schematic-to-netlist pipeline that combines visual recognition, topology construction, and domain-knowledge-guided multi-agent correction. The proposed method achieves 94.54% component detection mAP, 98.57% text recognition accuracy, and 84.47% end-to-end connectivity accuracy. PCBnet provides a benchmark and data foundation for future AI-driven PCB design automation.

Addressing the critical theme of recycling electronic waste (E-waste), this contribution is dedicated to developing advanced automated data processing pipelines as a basis for decision-making and process control. Aligning with the broader goals of the circular economy and the United Nations (UN) Sustainable Development Goals (SDG), our work leverages non-invasive analysis methods utilizing RGB and hyperspectral imaging data to provide both quantitative and qualitative insights into the E-waste stream composition for optimizing recycling efficiency. In this paper, we introduce 'PCB-Vision'; a pioneering RGB-hyperspectral printed circuit board (PCB) benchmark dataset, comprising 53 RGB images of high spatial resolution paired with their corresponding high spectral resolution hyperspectral data cubes in the visible and near-infrared (VNIR) range. Grounded in open science principles, our dataset provides a comprehensive resource for researchers through high-quality ground truths, focusing on three primary PCB components: integrated circuits (IC), capacitors, and connectors. We provide extensive statistical investigations on the proposed dataset together with the performance of several state-of-the-art (SOTA) models, including U-Net, Attention U-Net, Residual U-Net, LinkNet, and DeepLabv3+. By openly sharing this multi-scene benchmark dataset along with the baseline codes, we hope to foster transparent, traceable, and comparable developments of advanced data processing across various scientific communities, including, but not limited to, computer vision and remote sensing. Emphasizing our commitment to supporting a collaborative and inclusive scientific community, all materials, including code, data, ground truth, and masks, will be accessible at https://github.com/hifexplo/PCBVision.

Automatic visual inspection using machine learning plays a key role in achieving zero-defect policies in industry. Research on anomaly detection is constrained by the availability of datasets that capture complex defect appearances and imperfect imaging conditions, which are typical of production processes. Recent benchmarks indicate that most publicly available datasets are biased towards optimal imaging conditions, leading to an overestimation of their applicability in real-world industrial scenarios. To address this gap, we introduce the Industrial Screen Printing Anomaly Detection Dataset (ISP-AD). It presents challenging small and weakly contrasted surface defects embedded within structured patterns exhibiting high permitted design variability. To the best of our knowledge, it is the largest publicly available industrial dataset to date, including both synthetic and real defects collected directly from the factory floor. Beyond benchmarking recent unsupervised anomaly detection methods, experiments on a mixed supervised training strategy, incorporating both synthesized and real defects, were conducted. Experiments show that even a small amount of injected, weakly labeled real defects improves generalization. Furthermore, starting from training on purely synthetic defects, emerging real defective samples can be efficiently integrated into subsequent scalable training. Overall, our findings indicate that model-free synthetic defects can provide a cold-start baseline, whereas a small number of injected real defects refine the decision boundary for previously unseen defect characteristics. The presented unsupervised and supervised dataset splits are designed to emphasize research on unsupervised, self-supervised, and supervised approaches, enhancing their applicability to industrial settings.

The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and return a Wafer Defect Map (WDM), i.e., a list of the coordinates where defects lie, which can be considered a huge, sparse, and binary image. In normal conditions, wafers exhibit a small number of randomly distributed defects, while defects grouped in specific patterns might indicate known or novel categories of failures in the production line. Needless to say, a primary concern of semiconductor industries is to identify these patterns and intervene as soon as possible to restore normal production conditions. Here we address WDM monitoring as an open-set recognition problem to accurately classify WDM in known categories and promptly detect novel patterns. In particular, we propose a comprehensive pipeline for wafer monitoring based on a Submanifold Sparse Convolutional Network, a deep architecture designed to process sparse data at an arbitrary resolution, which is trained on the known classes. To detect novelties, we define an outlier detector based on a Gaussian Mixture Model fitted on the latent representation of the classifier. Our experiments on a real dataset of WDMs show that directly processing full-resolution WDMs by Submanifold Sparse Convolutions yields superior classification performance on known classes than traditional Convolutional Neural Networks, which require a preliminary binning to reduce the size of the binary images representing WDMs. Moreover, our solution outperforms state-of-the-art open-set recognition solutions in detecting novelties.

The emergence of new nanoscale technologies has imposed significant challenges to designing reliable electronic systems in radiation environments. A few types of radiation like Total Ionizing Dose (TID) effects often cause permanent damages on such nanoscale electronic devices, and current state-of-the-art technologies to tackle TID make use of expensive radiation-hardened devices. This paper focuses on a novel and different approach: using machine learning algorithms on consumer electronic level Field Programmable Gate Arrays (FPGAs) to tackle TID effects and monitor them to replace before they stop working. This condition has a research challenge to anticipate when the board results in a total failure due to TID effects. We observed internal measurements of the FPGA boards under gamma radiation and used three different anomaly detection machine learning (ML) algorithms to detect anomalies in the sensor measurements in a gamma-radiated environment. The statistical results show a highly significant relationship between the gamma radiation exposure levels and the board measurements. Moreover, our anomaly detection results have shown that a One-Class Support Vector Machine with Radial Basis Function Kernel has an average Recall score of 0.95. Also, all anomalies can be detected before the boards stop working.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

Power batteries are essential components in electric vehicles, where internal structural defects can pose serious safety risks. We conduct a comprehensive study on a new task, power battery detection (PBD), which aims to localize the dense endpoints of cathode and anode plates from industrial X-ray images for quality inspection. Manual inspection is inefficient and error-prone, while traditional vision algorithms struggle with densely packed plates, low contrast, scale variation, and imaging artifacts. To address this issue and drive more attention into this meaningful task, we present PBD5K, the first large-scale benchmark for this task, consisting of 5,000 X-ray images from nine battery types with fine-grained annotations and eight types of real-world visual interference. To support scalable and consistent labeling, we develop an intelligent annotation pipeline that combines image filtering, model-assisted pre-labeling, cross-verification, and layered quality evaluation. We formulate PBD as a point-level segmentation problem and propose MDCNeXt, a model designed to extract and integrate multi-dimensional structure clues including point, line, and count information from the plate itself. To improve discrimination between plates and suppress visual interference, MDCNeXt incorporates two state space modules. The first is a prompt-filtered module that learns contrastive relationships guided by task-specific prompts. The second is a density-aware reordering module that refines segmentation in regions with high plate density. In addition, we propose a distance-adaptive mask generation strategy to provide robust supervision under varying spatial distributions of anode and cathode positions. The source code and datasets will be publicly available at https://github.com/Xiaoqi-Zhao-DLUT/X-ray-PBD{PBD5K}.

Power line maintenance and inspection are essential to avoid power supply interruptions, reducing its high social and financial impacts yearly. Automating power line visual inspections remains a relevant open problem for the industry due to the lack of public real-world datasets of power line components and their various defects to foster new research. This paper introduces InsPLAD, a Power Line Asset Inspection Dataset and Benchmark containing 10,607 high-resolution Unmanned Aerial Vehicles colour images. The dataset contains seventeen unique power line assets captured from real-world operating power lines. Additionally, five of those assets present six defects: four of which are corrosion, one is a broken component, and one is a bird's nest presence. All assets were labelled according to their condition, whether normal or the defect name found on an image level. We thoroughly evaluate state-of-the-art and popular methods for three image-level computer vision tasks covered by InsPLAD: object detection, through the AP metric; defect classification, through Balanced Accuracy; and anomaly detection, through the AUROC metric. InsPLAD offers various vision challenges from uncontrolled environments, such as multi-scale objects, multi-size class instances, multiple objects per image, intra-class variation, cluttered background, distinct point-of-views, perspective distortion, occlusion, and varied lighting conditions. To the best of our knowledge, InsPLAD is the first large real-world dataset and benchmark for power line asset inspection with multiple components and defects for various computer vision tasks, with a potential impact to improve state-of-the-art methods in the field. It will be publicly available in its integrity on a repository with a thorough description. It can be found at https://github.com/andreluizbvs/InsPLAD.

The increasing global deployment of solar photovoltaic (PV) systems needs robust, scalable, and automated inspection technologies capable of detecting a wide range of panel flaws under a variety of operating situations. The lack of large-scale, multi-modal, publicly available annotated datasets is a major obstacle preventing advancement in this field. We introduce SolarFCD, an extensive dataset of solar panel defects created by methodically combining and reconciling three publicly accessible datasets covering two imaging modalities: RGB/Drone images and Thermal Infrared. The dataset consist of 4,435 images arranged under four unified defect classes such as: healthy images, Surface Obstruction, structural fault, and electrical fault. The dataset was divided into training, validation, and test splits at an 80:10:10 ratio through methodical label mapping, near-duplicate removal, and targeted augmentation of minority classes. Sixteen classification architectures from five design families were trained and assessed on the dataset to provide repeatable benchmark baselines. With an accuracy of 86.68%, precision of 88.65%, recall of 88.62%, and F1-score of 88.17%, ResNet101V2 performed the best overall. Per-class results showed balanced detection across all four defect categories within a narrow performance band of less than 1.2 percentage points. To promote open and repeatable research in automated PV inspection and solar energy operations and maintenance, the dataset, annotation files, and baseline code are made openly available.

PCB routing is the task of connecting the nets of a board with copper traces under strict design rules, yet learning-based methods still lag behind rule-based routers. We introduce PCBWorld, an open-source engine-grounded PCB routing environment built on KiCad, an electronic design automation (EDA) engine. As a human engineer does, agents in PCBWorld interactively route a board through the engine's native operations, guided by its Design Rule Check (DRC) feedback. The environment supports both RL and tool-using LLM agents. Alongside the environment, PCBWorld-Bench provides three board datasets in the native .kicad_pcb format, two controllable synthetic generators and 679 real open-source boards. It scores any completed board with eight engine-checked evaluation metrics, regardless of the routing method. In our experiments, agents in PCBWorld consistently outperformed grid-action RL policies and open-loop LLM baselines, and an RL policy trained only on synthetic boards transferred zero-shot to real boards, approaching rule-based routers. PCBWorld and PCBWorld-Bench are available at https://github.com/LGAI-Research/PCBWorld.

The field of industrial defect detection using machine learning and deep learning is a subject of active research. Datasets, also called benchmarks, are used to compare and assess research results. There is a number of datasets in industrial visual inspection, of varying quality. Thus, it is a difficult task to determine which dataset to use. Generally speaking, datasets which include a testing set, with precise labeling and made in real-world conditions should be preferred. We propose a study of existing benchmarks to compare and expose their characteristics and their use-cases. A study of industrial metrics requirements, as well as testing procedures, will be presented and applied to the studied benchmarks. We discuss our findings by examining the current state of benchmarks for industrial visual inspection, and by exposing guidelines on the usage of benchmarks.

In recent years, the deterioration of artificial materials used in structures has become a serious social issue, increasing the importance of inspections. Non-destructive testing is gaining increased demand due to its capability to inspect for defects and deterioration in structures while preserving their functionality. Among these, Laser Ultrasonic Visualization Testing (LUVT) stands out because it allows the visualization of ultrasonic propagation. This makes it visually straightforward to detect defects, thereby enhancing inspection efficiency. With the increasing number of the deterioration structures, challenges such as a shortage of inspectors and increased workload in non-destructive testing have become more apparent. Efforts to address these challenges include exploring automated inspection using machine learning. However, the lack of anomalous data with defects poses a barrier to improving the accuracy of automated inspection through machine learning. Therefore, in this study, we propose a method for automated LUVT inspection using an anomaly detection approach with a diffusion model that can be trained solely on negative examples (defect-free data). We experimentally confirmed that our proposed method improves defect detection and localization compared to general object detection algorithms used previously.

Anomaly detection is nowadays increasingly used in industrial applications and processes. One of the main fields of the appliance is the visual inspection for surface anomaly detection, which aims to spot regions that deviate from regularity and consequently identify abnormal products. Defect localization is a key task, that usually is achieved using a basic comparison between generated image and the original one, implementing some blob-analysis or image-editing algorithms, in the post-processing step, which is very biased towards the source dataset, and they are unable to generalize. Furthermore, in industrial applications, the totality of the image is not always interesting but could be one or some regions of interest (ROIs), where only in those areas there are relevant anomalies to be spotted. For these reasons, we propose a new architecture composed by two blocks. The first block is a Generative Adversarial Network (GAN), based on a residual autoencoder (ResAE), to perform reconstruction and denoising processes, while the second block produces image segmentation, spotting defects. This method learns from a dataset composed of good products and generated synthetic defects. The discriminative network is trained using a ROI for each image contained in the training dataset. The network will learn in which area anomalies are relevant. This approach guarantees the reduction of using pre-processing algorithms, formerly developed with blob-analysis and image-editing procedures. To test our model we used challenging MVTec anomaly detection datasets and an industrial large dataset of pharmaceutical BFS strips of vials. This set constitutes a more realistic use case of the aforementioned network.

Visual anomaly detection plays a crucial role in not only manufacturing inspection to find defects of products during manufacturing processes, but also maintenance inspection to keep equipment in optimum working condition particularly outdoors. Due to the scarcity of the defective samples, unsupervised anomaly detection has attracted great attention in recent years. However, existing datasets for unsupervised anomaly detection are biased towards manufacturing inspection, not considering maintenance inspection which is usually conducted under outdoor uncontrolled environment such as varying camera viewpoints, messy background and degradation of object surface after long-term working. We focus on outdoor maintenance inspection and contribute a comprehensive Maintenance Inspection Anomaly Detection (MIAD) dataset which contains more than 100K high-resolution color images in various outdoor industrial scenarios. This dataset is generated by a 3D graphics software and covers both surface and logical anomalies with pixel-precise ground truth. Extensive evaluations of representative algorithms for unsupervised anomaly detection are conducted, and we expect MIAD and corresponding experimental results can inspire research community in outdoor unsupervised anomaly detection tasks. Worthwhile and related future work can be spawned from our new dataset.

Precise optical inspection in industrial applications is crucial for minimizing scrap rates and reducing the associated costs. Besides merely detecting if a product is anomalous or not, it is crucial to know the distinct type of defect, such as a bent, cut, or scratch. The ability to recognize the "exact" defect type enables automated treatments of the anomalies in modern production lines. Current methods are limited to solely detecting whether a product is defective or not without providing any insights on the defect type, nevertheless detecting and identifying multiple defects. We propose MultiADS, a zero-shot learning approach, able to perform Multi-type Anomaly Detection and Segmentation. The architecture of MultiADS comprises CLIP and extra linear layers to align the visual- and textual representation in a joint feature space. To the best of our knowledge, our proposal, is the first approach to perform a multi-type anomaly segmentation task in zero-shot learning. Contrary to the other baselines, our approach i) generates specific anomaly masks for each distinct defect type, ii) learns to distinguish defect types, and iii) simultaneously identifies multiple defect types present in an anomalous product. Additionally, our approach outperforms zero/few-shot learning SoTA methods on image-level and pixel-level anomaly detection and segmentation tasks on five commonly used datasets: MVTec-AD, Visa, MPDD, MAD and Real-IAD.

Visual anomaly detection is commonly used in industrial quality inspection. In this paper, we present a new dataset as well as a new self-supervised learning method for ImageNet pre-training to improve anomaly detection and segmentation in 1-class and 2-class 5/10/high-shot training setups. We release the Visual Anomaly (VisA) Dataset consisting of 10,821 high-resolution color images (9,621 normal and 1,200 anomalous samples) covering 12 objects in 3 domains, making it the largest industrial anomaly detection dataset to date. Both image and pixel-level labels are provided. We also propose a new self-supervised framework - SPot-the-difference (SPD) - which can regularize contrastive self-supervised pre-training, such as SimSiam, MoCo and SimCLR, to be more suitable for anomaly detection tasks. Our experiments on VisA and MVTec-AD dataset show that SPD consistently improves these contrastive pre-training baselines and even the supervised pre-training. For example, SPD improves Area Under the Precision-Recall curve (AU-PR) for anomaly segmentation by 5.9% and 6.8% over SimSiam and supervised pre-training respectively in the 2-class high-shot regime. We open-source the project at http://github.com/amazon-research/spot-diff .

In industrial settings, surface defects on steel can significantly compromise its service life and elevate potential safety risks. Traditional defect detection methods predominantly rely on manual inspection, which suffers from low efficiency and high costs. Although automated defect detection approaches based on Convolutional Neural Networks(e.g., Mask R-CNN) have advanced rapidly, their reliability remains challenged due to data annotation uncertainties during deep model training and overfitting issues. These limitations may lead to detection deviations when processing the given new test samples, rendering automated detection processes unreliable. To address this challenge, we first evaluate the detection model's practical performance through calibration data that satisfies the independent and identically distributed (i.i.d) condition with test data. Specifically, we define a loss function for each calibration sample to quantify detection error rates, such as the complement of recall rate and false discovery rate. Subsequently, we derive a statistically rigorous threshold based on a user-defined risk level to identify high-probability defective pixels in test images, thereby constructing prediction sets (e.g., defect regions). This methodology ensures that the expected error rate (mean error rate) on the test set remains strictly bounced by the predefined risk level. Additionally, we observe a negative correlation between the average prediction set size and the risk level on the test set, establishing a statistically rigorous metric for assessing detection model uncertainty. Furthermore, our study demonstrates robust and efficient control over the expected test set error rate across varying calibration-to-test partitioning ratios, validating the method's adaptability and operational effectiveness.

Packaging has become a crucial process due to the paradigm shift of More than Moore. Addressing manufacturing and yield issues is a significant challenge for modern layout algorithms. We propose to use printed circuit board (PCB) placement as a benchmark for the packaging problem. A maximum-margin formulation is devised to improve the separation between nets. Our framework includes seed layout proposals, a coordinate descent-based procedure to optimize routability, and a mixed-integer linear programming method to legalize the layout. We perform an extensive study with 14 PCB designs and an open-source router. We show that the placements produced by NS-place improve routed wirelength by up to 25\%, reduce the number of vias by up to 50\%, and reduce the number of DRVs by 79\% compared to manual and wirelength-minimal placements.

We introduce the first comprehensive 3D dataset for the task of unsupervised anomaly detection and localization. It is inspired by real-world visual inspection scenarios in which a model has to detect various types of defects on manufactured products, even if it is trained only on anomaly-free data. There are defects that manifest themselves as anomalies in the geometric structure of an object. These cause significant deviations in a 3D representation of the data. We employed a high-resolution industrial 3D sensor to acquire depth scans of 10 different object categories. For all object categories, we present a training and validation set, each of which solely consists of scans of anomaly-free samples. The corresponding test sets contain samples showing various defects such as scratches, dents, holes, contaminations, or deformations. Precise ground-truth annotations are provided for every anomalous test sample. An initial benchmark of 3D anomaly detection methods on our dataset indicates a considerable room for improvement.

Reliable anomaly detection in photovoltaic (PV) modules is critical for maintaining solar energy efficiency. However, developing robust computer vision models for PV inspection is constrained by the scarcity of large-scale, diverse, and balanced datasets. This study introduces PV-DDPM, a spatially conditioned denoising diffusion probabilistic model that generates anomalous electroluminescence (EL) images across four PV cell types: multi-crystalline silicon (multi-c-Si), mono-crystalline silicon (mono-c-Si), half-cut multi-c-Si, and interdigitated back contact (IBC) with dogbone interconnect. PV-DDPM enables controlled synthesis of single-defect and multi-defect scenarios by conditioning on binary masks representing structural features and defect positions. To the best of our knowledge, this is the first framework that jointly models multiple PV cell types while supporting simultaneous generation of diverse anomaly types. We also introduce E-SCDD, an enhanced version of the SCDD dataset, comprising 1,000 pixel-wise annotated EL images spanning 30 semantic classes, and 1,768 unlabeled synthetic samples. Quantitative evaluation shows our generated images achieve a Fréchet Inception Distance (FID) of 4.10 and Kernel Inception Distance (KID) of 0.0023 pm 0.0007 across all categories. Training the vision--language anomaly detection model AA-CLIP on E-SCDD, compared to the SCDD dataset, improves pixel-level AUC and average precision by 1.70 and 8.34 points, respectively.

Precision in identifying nanometer-scale device-killer defects is crucial in both semiconductor research and development as well as in production processes. The effectiveness of existing ML-based approaches in this context is largely limited by the scarcity of data, as the production of real semiconductor wafer data for training these models involves high financial and time costs. Moreover, the existing simulation methods fall short of replicating images with identical noise characteristics, surface roughness and stochastic variations at advanced nodes. We propose a method for generating synthetic semiconductor SEM images using a diffusion model within a limited data regime. In contrast to images generated through conventional simulation methods, SEM images generated through our proposed DL method closely resemble real SEM images, replicating their noise characteristics and surface roughness adaptively. Our main contributions, which are validated on three different real semiconductor datasets, are: i) proposing a patch-based generative framework utilizing DDPM to create SEM images with intended defect classes, addressing challenges related to class-imbalance and data insufficiency, ii) demonstrating generated synthetic images closely resemble real SEM images acquired from the tool, preserving all imaging conditions and metrology characteristics without any metadata supervision, iii) demonstrating a defect detector trained on generated defect dataset, either independently or combined with a limited real dataset, can achieve similar or improved performance on real wafer SEM images during validation/testing compared to exclusive training on a real defect dataset, iv) demonstrating the ability of the proposed approach to transfer defect types, critical dimensions, and imaging conditions from one specified CD/Pitch and metrology specifications to another, thereby highlighting its versatility.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field

Too many defective compute chips are escaping existing manufacturing tests -- at least an order of magnitude more than industrial targets across all compute chip types in data centers. Silent data corruptions (SDCs) caused by test escapes, when left unaddressed, pose a major threat to reliable computing. We present a three-pronged approach outlining future directions for overcoming test escapes: (a) Quick diagnosis of defective chips directly from system-level incorrect behaviors. Such diagnosis is critical for gaining insights into why so many defective chips escape existing manufacturing testing. (b) In-field detection of defective chips. (c) New test experiments to understand the effectiveness of new techniques for detecting defective chips. These experiments must overcome the drawbacks and pitfalls of previous industrial test experiments and case studies.

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

Industrial visual inspection in pharmaceutical production requires high accuracy under strict constraints on cycle time, hardware footprint, and operational cost. Manual inline inspection is still common, but it is affected by operator variability and limited throughput. Classical rule-based computer vision pipelines are often rigid and difficult to scale to highly variable production scenarios. To address these limitations, we present a semi-supervised anomaly detection framework based on a generative adversarial architecture with a residual autoencoder and a dense bottleneck, specifically designed for online deployment on a high-speed Blow-Fill-Seal (BFS) line. The model is trained only on nominal samples and detects anomalies through reconstruction residuals, providing both classification and spatial localization via heatmaps. The training set contains 2,815,200 grayscale patches. Experiments on a real industrial test kit show high detection performance while satisfying timing constraints compatible with a 500 ms acquisition slot.

Pipeline integrity is critical to industrial safety and environmental protection, with Magnetic Flux Leakage (MFL) detection being a primary non-destructive testing technology. Despite the promise of deep learning for automating MFL interpretation, progress toward reliable models has been constrained by the absence of a large-scale public dataset and benchmark, making fair comparison and reproducible evaluation difficult. We introduce PipeMFL-240K, a large-scale, meticulously annotated dataset and benchmark for complex object detection in pipeline MFL pseudo-color images. PipeMFL-240K reflects real-world inspection complexity and poses several unique challenges: (i) an extremely long-tailed distribution over 12 categories, (ii) a high prevalence of tiny objects that often comprise only a handful of pixels, and (iii) substantial intra-class variability. The dataset contains 240,320 images and 191,530 high-quality bounding-box annotations, collected from 11 pipelines spanning approximately 1,480 km. Extensive experiments are conducted with state-of-the-art object detectors to establish baselines. Results show that modern detectors still struggle with the intrinsic properties of MFL data, highlighting considerable headroom for improvement, while PipeMFL-240K provides a reliable and challenging testbed to drive future research. As the first public dataset and the first benchmark of this scale and scope for pipeline MFL inspection, it provides a critical foundation for efficient pipeline diagnostics as well as maintenance planning and is expected to accelerate algorithmic innovation and reproducible research in MFL-based pipeline integrity assessment.

Being able to spot defective parts is a critical component in large-scale industrial manufacturing. A particular challenge that we address in this work is the cold-start problem: fit a model using nominal (non-defective) example images only. While handcrafted solutions per class are possible, the goal is to build systems that work well simultaneously on many different tasks automatically. The best performing approaches combine embeddings from ImageNet models with an outlier detection model. In this paper, we extend on this line of work and propose PatchCore, which uses a maximally representative memory bank of nominal patch-features. PatchCore offers competitive inference times while achieving state-of-the-art performance for both detection and localization. On the challenging, widely used MVTec AD benchmark PatchCore achieves an image-level anomaly detection AUROC score of up to 99.6%, more than halving the error compared to the next best competitor. We further report competitive results on two additional datasets and also find competitive results in the few samples regime.^* Work done during a research internship at Amazon AWS. Code: github.com/amazon-research/patchcore-inspection.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Combined electric power system and High-Altitude Electromagnetic Pulse (HEMP) models are being developed to determine the effect of a HEMP on the US power grid. The work relies primarily on deterministic methods; however, it is computationally untenable to evaluate the E1 HEMP response of large numbers of grid components distributed across a large interconnection. Further, the deterministic assessment of these components' failures are largely unachievable. E1 HEMP laboratory testing of the components is accomplished, but is expensive, leaving few data points to construct failure models of grid components exposed to E1 HEMP. The use of Bayesian priors, developed using the subject matter expertise, combined with the minimal test data in a Bayesian inference process, provides the basis for the development of more robust and cost-effective statistical component failure models. These can be used with minimal computational burden in a simulation environment such as sampling of Cumulative Distribution Functions (CDFs).

Accurate defect segmentation is critical for industrial inspection, yet dense pixel-level annotations are rarely available. A common workaround is to convert inexpensive bounding boxes into pseudo-masks using foundation segmentation models such as the Segment Anything Model (SAM). However, these pseudo-labels are systematically noisy on industrial surfaces, often hallucinating background structure while missing sparse defects. To address this limitation, a noise-robust box-to-pixel distillation framework, Boxes2Pixels, is proposed that treats SAM as a noisy teacher rather than a source of ground-truth supervision. Bounding boxes are converted into pseudo-masks offline by SAM, and a compact student is trained with (i) a hierarchical decoder over frozen DINOv2 features for semantic stability, (ii) an auxiliary binary localization head to decouple sparse foreground discovery from class prediction, and (iii) a one-sided online self-correction mechanism that relaxes background supervision when the student is confident, targeting teacher false negatives. On a manually annotated wind turbine inspection benchmark, the proposed Boxes2Pixels improves anomaly mIoU by +6.97 and binary IoU by +9.71 over the strongest baseline trained under identical weak supervision. Moreover, online self-correction increases the binary recall by +18.56, while the model employs 80\% fewer trainable parameters. Code is available at https://github.com/CLendering/Boxes2Pixels.

Industrial plants are prone to faults. To notify the operator of a fault occurrence, alarms are utilized as a basic part of modern computer-controlled plants. However, due to the interconnections of different parts of a plant, a single fault often propagates through the plant and triggers a (sometimes large) number of alarms. A graphical plant topology can help operators, process engineers and maintenance experts find the root cause of a plant upset or discover the propagation path of a fault. In this paper, a method is developed to extract plant topology form alarm data. The method is based on process mining, a collection of concepts and algorithms that model a process (not necessarily an engineering one) based on recorded events. The event based nature of alarm data as well as the chronological order of recorded alarms make them suitable for process mining. The methodology developed in this paper is based on preparing alarm data for process mining and then using the suitable process mining algorithms to extract plant topology. The extracted topology is represented by the familiar Petri net which can be used for root cause analysis and discovering fault propagation paths. The methods to evaluate the extracted topology are also discussed. A case study on the well-known Tennessee Eastman process demonstrates the utility of the proposed method.

Despite progress in vision-based inspection algorithms, real-world industrial challenges -- specifically in data availability, quality, and complex production requirements -- often remain under-addressed. We introduce the VISION Datasets, a diverse collection of 14 industrial inspection datasets, uniquely poised to meet these challenges. Unlike previous datasets, VISION brings versatility to defect detection, offering annotation masks across all splits and catering to various detection methodologies. Our datasets also feature instance-segmentation annotation, enabling precise defect identification. With a total of 18k images encompassing 44 defect types, VISION strives to mirror a wide range of real-world production scenarios. By supporting two ongoing challenge competitions on the VISION Datasets, we hope to foster further advancements in vision-based industrial inspection.

We present the Open Stamped Parts Dataset (OSPD), featuring synthetic and real images of stamped metal sheets for auto manufacturing. The real part images, captured from 7 cameras, consist of 7,980 unlabeled images and 1,680 labeled images. In addition, we have compiled a defect dataset by overlaying synthetically generated masks on 10\% of the holes. The synthetic dataset replicates the real manufacturing environment in terms of lighting and part placement relative to the cameras. The synthetic data includes 7,980 training images, 1,680 validation images and 1,680 test images, each with bounding box and segmentation mask annotations around all holes. 10\% of the holes in the synthetic data mimic defects generated in the real image dataset. We trained a hole-detection model on the synthetic-OSPD, achieving a modified recall score of 67.2\% and a precision of 94.4\% . We anticipate researchers in auto manufacturing use OSPD to advance the state of the art in defect detection of stamped holes in the metal-sheet stamping process. The dataset is available for download at: https://tinyurl.com/hm6xatd7.

Internal defect detection constitutes a critical process in ensuring component quality, for which anomaly detection serves as an effective solution. However, existing anomaly detection datasets predominantly focus on surface defects in visible-light images, lacking publicly available X-ray datasets targeting internal defects in components. To address this gap, we construct the first publicly accessible component X-ray anomaly detection (CXR-AD) dataset, comprising real-world X-ray images. The dataset covers five industrial component categories, including 653 normal samples and 561 defect samples with precise pixel-level mask annotations. We systematically analyze the dataset characteristics and identify three major technical challenges: (1) strong coupling between complex internal structures and defect regions, (2) inherent low contrast and high noise interference in X-ray imaging, and (3) significant variations in defect scales and morphologies. To evaluate dataset complexity, we benchmark three state-of-the-art anomaly detection frameworks (feature-based, reconstruction-based, and zero-shot learning methods). Experimental results demonstrate a 29.78% average performance degradation on CXR-AD compared to MVTec AD, highlighting the limitations of current algorithms in handling internal defect detection tasks. To the best of our knowledge, CXR-AD represents the first publicly available X-ray dataset for component anomaly detection, providing a real-world industrial benchmark to advance algorithm development and enhance precision in internal defect inspection technologies.

Digital design requires predicting how a metal surface will look later in its oxidation; this paper presents such a pipeline for copper. Given a fixed-camera observation, the system forecasts appearance 10 accelerated units ahead and converts it into the albedo, normal, roughness and metallic maps a renderer consumes. Forecasting is evaluated as an authoring tool would use it, on a copper specimen the system has not observed: an entire recording is held out, so training and checkpoint selection use one specimen and the test set is the whole of a second, recorded on a different day and condition. Under this protocol a learned spatio-temporal model with a monotone oxidation state, the most accurate forecaster within a single recording, is less accurate than copying the last observed frame on an unseen specimen, in both directions, as are three further trained architectures. The only forecaster that transfers is a closed-form global color extrapolation with no trained parameters, improving on copy-last-frame by 13.4% and 50.6%, with a margin that increases with horizon to +16.7% and +55.5% at t+10. Two controls qualify this: correcting every frame for the photometric drift measured on a non-oxidizing reference region leaves both margins intact, ruling out uncontrolled exposure as their source, and a moving-block bootstrap over the 6 independent windows each recording contains separates the larger margin from zero but leaves the smaller one not individually significant. The mechanism is measured: a learned susceptibility map encodes where corrosion begins on the training specimen and misleads on a new one, whereas the global color trajectory is what specimens share. The pipeline therefore deploys the closed-form forecaster for unseen specimens and the learned model only for continuing one already observed. Code, splits, protocol and leakage audit are released.

Regulatory compliance auditing across diverse industrial domains requires heightened quality assurance and traceability. Present manual and intermittent approaches to such auditing yield significant challenges, potentially leading to oversights in the monitoring process. To address these issues, we introduce a real-time, multi-modal sensing system employing 3D time-of-flight and RGB cameras, coupled with unsupervised learning techniques on edge AI devices. This enables continuous object tracking thereby enhancing efficiency in record-keeping and minimizing manual interventions. While we validate the system in a knife sanitization context within agrifood facilities, emphasizing its prowess against occlusion and low-light issues with RGB cameras, its potential spans various industrial monitoring settings.

Within (semi-)automated visual industrial inspection, learning-based approaches for assessing visual defects, including deep neural networks, enable the processing of otherwise small defect patterns in pixel size on high-resolution imagery. The emergence of these often rarely occurring defect patterns explains the general need for labeled data corpora. To alleviate this issue and advance the current state of the art in unsupervised visual inspection, this work proposes a DifferNet-based solution enhanced with attention modules: AttentDifferNet. It improves image-level detection and classification capabilities on three visual anomaly detection datasets for industrial inspection: InsPLAD-fault, MVTec AD, and Semiconductor Wafer. In comparison to the state of the art, AttentDifferNet achieves improved results, which are, in turn, highlighted throughout our quali-quantitative study. Our quantitative evaluation shows an average improvement - compared to DifferNet - of 1.77 +/- 0.25 percentage points in overall AUROC considering all three datasets, reaching SOTA results in InsPLAD-fault, an industrial inspection in-the-wild dataset. As our variants to AttentDifferNet show great prospects in the context of currently investigated approaches, a baseline is formulated, emphasizing the importance of attention for industrial anomaly detection both in the wild and in controlled environments.

Ensuring the safety, quality, and timely completion of construction projects is paramount, with construction inspections serving as a vital instrument towards these goals. Nevertheless, the predominantly manual approach of present-day inspections frequently results in inefficiencies and inadequate information management. Such methods often fall short of providing holistic, exhaustive assessments, consequently engendering regulatory oversights and potential safety hazards. To address this issue, this paper presents a novel framework named AutoRepo for automated generation of construction inspection reports. The unmanned vehicles efficiently perform construction inspections and collect scene information, while the multimodal large language models (LLMs) are leveraged to automatically generate the inspection reports. The framework was applied and tested on a real-world construction site, demonstrating its potential to expedite the inspection process, significantly reduce resource allocation, and produce high-quality, regulatory standard-compliant inspection reports. This research thus underscores the immense potential of multimodal large language models in revolutionizing construction inspection practices, signaling a significant leap forward towards a more efficient and safer construction management paradigm.

One persistent obstacle in industrial quality inspection is the detection of anomalies. In real-world use cases, two problems must be addressed: anomalous data is sparse and the same types of anomalies need to be detected on previously unseen objects. Current anomaly detection approaches can be trained with sparse nominal data, whereas domain generalization approaches enable detecting objects in previously unseen domains. Utilizing those two observations, we introduce the hybrid task of domain generalization on sparse classes. To introduce an accompanying dataset for this task, we present a modification of the well-established MVTec AD dataset by generating three new datasets. In addition to applying existing methods for benchmark, we design two embedding-based approaches, Spatial Embedding MLP (SEMLP) and Labeled PatchCore. Overall, SEMLP achieves the best performance with an average image-level AUROC of 87.2 % vs. 80.4 % by MIRO. The new and openly available datasets allow for further research to improve industrial anomaly detection.

Industrial visual anomaly detection is usually one-class: normal images are abundant, while defects are rare, heterogeneous, and often unavailable during system design. PatchCore-style retrieval suits this setting because it scores test images from a memory bank of normal patch features, but the standard Euclidean geometry ignores feature correlations and its offline construction materialises the full patch pool before subsampling. We introduce Mahalanobis PatchCore, a covariance-aware, streaming-compatible extension of PatchCore. Its artificial intelligence contribution is a retrieval detector that estimates a regularised covariance model in reduced feature space and whitens embeddings, so Euclidean nearest-neighbour search after transformation implements Mahalanobis retrieval. A bounded-memory, re-iterable training pipeline builds the memory bank without storing all normal patches at once, using incremental dimensionality reduction, online covariance estimation, and streaming aggregation. The engineering application is automated industrial inspection, where visual anomaly detection must remain accurate under practical memory limits. We evaluate the method on a public 15-category industrial anomaly-detection benchmark and three industrial datasets covering blow-fill-seal strip-ampoule meniscus inspection, amber-glass-ampoule bottom inspection, and lyophilised-cake vial inspection. Mahalanobis PatchCore preserves most offline PatchCore image-level performance on the public benchmark while reducing peak memory from 5.41 to 2.78 GB, and improves the selected industrial mean image area under the receiver operating characteristic curve from 0.981 to 0.986.

The global trade in electronic and electrical goods is complicated by the challenge of identifying e-waste, which is often misclassified to evade regulations. Traditional analysis methods struggle to discern the underlying patterns of this illicit trade within vast datasets. This research proposes and validates a robust, data-driven framework to segment products and identify goods exhibiting an anomalous "waste signature" a trade pattern defined by a clear 'inverse price-volume'. The core of the framework is an Outlier-Aware Segmentation method, an iterative K-Means approach that first isolates extreme outliers to prevent data skewing and then re-clusters the remaining products to reveal subtle market segments. To quantify risk, a "Waste Score" is developed using a Logistic Regression model that identifies products whose trade signatures are statistically similar to scrap. The findings reveal a consistent four-tier market hierarchy in both Malaysian and global datasets. A key pattern emerged from a comparative analysis: Malaysia's market structure is defined by high-volume bulk commodities, whereas the global market is shaped by high-value capital goods, indicating a unique national specialization. The framework successfully flags finished goods, such as electric generators (HS 8502), that are traded like scrap, providing a targeted list for regulatory scrutiny.